With trends like IoT, smart cities, connected transportation, mobile and edge computing driving our world, semiconductors that deliver more memory and speed are in demand. The pressure is on to deliver performance and cost-effective consistency to the Chemical Mechanical Planarization (CMP) process in semiconductor manufacturing. Demand to continually increase yield leaves no room for variation in a fab's production that risks waste or device reliability. 3M is redefining CMP products with our 3M™ Trizact™ CMP Pads to ensure consistent CMP process performance.
Our 3M™ Trizact™ CMP Pads blend 3M’s know-how in moulding, surface modification and microreplication, delivering an innovative pad for Chemical Mechanical Polishing for advanced node semiconductor manufacturing.
Designed to deliver the CMP performance you need, 3M™ Trizact™ CMP Pads are engineered using our proprietary microreplication process. The result is a pad that is consistent and well-characterised helping to ensure that tomorrow’s pad is the same as today’s.
Consistent and repeatable CMP performance leads to increased yield. 3M™ Trizact™ CMP Pads help increase planarization efficiency, reduce defects, and improve productivity and output.
Our proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner.
At the core of the 3M™ Trizact™ CMP Pad is one of 3M’s core technology platforms — microreplication. This technology allows us to deliver excellent uniformity to surfaces with precisely sculpted microscopic features. While this technology was originally born to deliver light management properties to overhead projectors, it has since been extended to tens of thousands of 3M products.
The mechanisms responsible for the unique performance of MR pads will be elucidated and the significance of this new CMP pad technology will be discussed.
Read more about the 3M™ Trizact™ CMP Pad for Cobalt buff CMP defectivity and topography performance presented by Global Foundries at the 2017 IEEE International Interconnect Technology Conference (IITC).