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an image of the 3m Trizact cmp pads with independent unit cells — shown here as an optical microscope image
3M™ Trizact™ CMP Pads

Designed for highly repeatable performance and efficiency in semiconductor manufacturing.

  • Innovative groove design of the 3M™ Trizact™ CMP Pad with independent unit cells — shown here as an optical microscope image.

Delivering a predictable, stable, consistent performance to your Chemical Mechanical Planarisation process — every time.

With trends like IoT, smart cities, connected transportation, mobile and edge computing driving our world, semiconductors that deliver more memory and speed are in demand. The pressure is on to deliver performance and cost-effective consistency to the Chemical Mechanical Planarization (CMP) process in semiconductor manufacturing. Demand to continually increase yield leaves no room for variation in a fab's production that risks waste or device reliability. 3M is redefining CMP products with our 3M™ Trizact™ CMP Pads to ensure consistent CMP process performance.

  • Advanced node semiconductor manufacturing

    Advanced performance for your advanced nodes.

    Our 3M™ Trizact™ CMP Pads blend 3M’s know-how in moulding, surface modification and microreplication, delivering an innovative pad for Chemical Mechanical Polishing for advanced node semiconductor manufacturing.

    • Uses precisely engineered three-dimensional microreplicated asperities and pores to define the pad texture and help ensure consistent performance pad-to-pad — meeting the demands of advance node CMP processes.
    • Asperities and pores are arranged into independent unit cells to enable uniform pressure across the wafer.
    • Our highly controlled microreplication process delivers repeatable and tunable CMP pads.

behind the scenes in the lab of how 3m Trizact cmp pads are engineered

Reduced variability and increased repeatability — delivering improved yield.

  • Consistency

    Designed to deliver the CMP performance you need, 3M™ Trizact™ CMP Pads are engineered using our proprietary microreplication process. The result is a pad that is consistent and well-characterised helping to ensure that tomorrow’s pad is the same as today’s.

    • Uniformity in the polishing process.
    • Consistent texture from pad to pad.
    • Stability through pad life.
  • Improved Yield

    Consistent and repeatable CMP performance leads to increased yield. 3M™ Trizact™ CMP Pads help increase planarization efficiency, reduce defects, and improve productivity and output.

    • Improved planarization efficiency to enable advanced node CMP.
    • Reduced dishing and erosion.
    • Less pad debris for fewer defects.
  • Reduced Consumables

    Our proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner.

    • Reduced metal contamination risk.
    • Lower cost of ownership.
    • Longer life, less downtime.

  • Microreplication — uniformity at the most microscopic level.

    At the core of the 3M™ Trizact™ CMP Pad is one of 3M’s core technology platforms — microreplication. This technology allows us to deliver excellent uniformity to surfaces with precisely sculpted microscopic features. While this technology was originally born to deliver light management properties to overhead projectors, it has since been extended to tens of thousands of 3M products.

connect with our experts to learn more about 3m Trizact cmp pads for Chemical Mechanical Polishing in semiconductor manufacturing
Ready to Redefine Your CMP Process?​

Learn more about how to advance your CMP process with 3M’s innovative CMP products.



  • Microreplication in Chemical Mechanical Planarization with 3M CMP Pads
  • Technical paper published by The Electrochemical Society (ECS), August 2016

    The mechanisms responsible for the unique performance of MR pads will be elucidated and the significance of this new CMP pad technology will be discussed.

  • Groove design of the 3M Trizact CMP Pad magnified
    Innovative groove design of 3M™ Trizact™ CMP pad – SEM image at 35x magnification

    Technical paper published by Institute of Electrical and Electronics Engineers (IEEE), May 2017

    Read more about the 3M™ Trizact™ CMP Pad for Cobalt buff CMP defectivity and topography performance presented by Global Foundries at the 2017 IEEE International Interconnect Technology Conference (IITC).

Meet the demands of your semiconductor manufacturing process.

Explore 3M products for your semiconductor manufacturing and handling that can help increase productivity, provide high-performance, precision, and efficiency.