Designed for semiconductor processes, the 3M Wafer Support System (WSS) offers fast and clean
temporary wafer bonding and debonding. It is a production-proven and cost-effective solution for handling wafers down to 20 microns during the backgrinding and subsequent high temperature 3D TSV processes.
3M Fluoropolymers have excellent heat transfer properties in semiconductor processing and can be used in solvent cleaning for precision components. From chemical- and temperature-resistant seals to high-purity wafer carriers, these elastomers and plastics are engineered to reduce contamination.