3M is redefining CMP products with our 3M™ Trizact™ CMP Pads to help ensure consistent CMP process performance. The CMP Pads blend 3M’s know-how in molding, surface modification and microreplication, delivering an innovative pad for CMP process for advanced node semiconductor manufacturing.
Highly engineered 3M Pad Conditioners for CMP provide reliable performance for critical semiconductor CMP applications. They help reduce the number of maintenance shutdowns and are optimised for extended pad and disk life.