3M brings precision, performance and efficiency to your semiconductor manufacturing process.
If you are involved in semiconductor manufacturing and handling, 3M Singapore has the solutions to help. Our expertise in areas like microreplication, nanotechnology, and moulding provide solutions which help enable the uniformity, cleanliness and precision your industry's processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. This includes everything from materials used in etching and deposition, chemical mechanical planarization (CMP) and surface finishing materials for wafer processing, fluids for thermal management, tape and reel for chip transport and materials for wafer doping and ion implantation.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
3M™ Trizact™ CMP Pads are designed to deliver predictable, stable, and consistent performance to your CMP process, leading to improved efficiency, reduced erosion, and increased yield. 3M's know-how in moulding, surface modification and microreplication enables the creation of this innovative pad that meets the demands of advanced node CMP processes.
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
These micro-structured additives improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.
High-performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.
3M CMP and surface finishing materials can help increase productivity, improve yields and provide high-quality process performance.
From chemical- and temperature-resistant seals to high-purity wafer carriers, these elastomers and plastics are engineered to reduce contamination.
Help protect your components during shipping and storage to meet your requirements and increase productivity.
The versatile product design helps enable reliable performance for test and burn-in applications.
Keep your cool when fabricating wafers
The semiconductor fabrication process demands precise temperature control. You can get the performance you need and more when you use 3M Novec Engineered Fluids as your heat transfer working fluid.
Novec fluids are non-conductive and low-maintenance — providing advantages over many common heat transfer fluids. These dielectric fluids offer a wide range of operating temperatures, making them useful for cold-plate cooling, automated testing, plasma etching and chemical vapour deposition equipment. They do it all without compromising worker safety or environmental sustainability.
Download the 3M Novec fluids for heat transfer product selection guide (PDF, 79 KB)
Clean, cost-effective semiconductor manufacturing
Frequent and thorough cleaning of equipment and tools used in semiconductor manufacturing is critical to removing particulates and other contaminants that can lead to device failure.
Unfortunately, some conventional solvents, such as IPA and acetone, are flammable and can be damaging to certain delicate materials. Non-flammable options, such as aqueous cleaning processes, can leave residue and increase the risk of corrosion. They may also require higher capital equipment and operating costs.
That’s why 3M offers non-flammable, advanced cleaning solvents to help address your performance, safety and environmental needs.
Have questions or need help finding the right semiconductor product? Simply click on the button to contact us and send us a message.