Step up to the next level in semiconductor manufacturing using 3M™ CMP Materials
Redefine Chemical Mechanical Planarisation (CMP) process with advanced 3M™ CMP Materials
What is chemical mechanical planarization (CMP)?
The rapid growth of new cloud computing, AI, big data technology, 5G, Internet of Things, mobility and automation applications is driving rising demand for the latest semiconductor manufacturing technology. To power these applications, advanced semiconductor manufacturing is consistently pushing the limits of what’s possible. New device architectures, novel materials and complex integration schemes call for increases in process intensity and complexity. Chemical mechanical planarisation (CMP) plays a critical role in enabling these integrated processes for mature and advanced node technologies.
At 3M, we’re redefining CMP solutions with innovative CMP pads, polishing pad conditioners, and pad conditioner coatings. A trusted supplier with more than 25 years in the CMP market, we’re here to address a range of process needs including improved consistency, reduced variability, improved planarisation performance, metal contamination and defectivity control, higher yield, and longer consumable lifetime.
Unleash the power of CMP
Drawing from over 50 technology platforms, 3M develops high quality, consistent CMP disks. These are driven by our proprietary microreplication technology and expertise in surface modification, molding and adhesion. This dedication to consistency and customisation helps you gain more control over your chemical mechanical planarisation process and enjoy more cost-of-ownership benefits. What's more, our dedicated technical experts provide you with direct and personalised support. Local sampling and product iterations are available to you thanks to our global laboratory and manufacturing capabilities.
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Consistency• Quality materials
• Reduced variation
• Improved stability, predictability -
Customization• Tailored solutions
• Tunable attributes -
Control• Stable lifetime performance
• Extended lifespan
• Reduced tool downtime -
Cost of Ownership• Less contamination risks
• Reduced defectivity
• Improved yield
Powering node-to-node CMP innovations for every tech generation
Innovation is at the core of 3M Semiconductor solutions. From technology breakthroughs for CMP pads to optimized CMP pad conditioners, we exceed expectations with partners like you.
Pick your CMP solution for a smooth planarisation process
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These advanced pads help you achieve consistent pad-to-pad performance, limit metal contamination risks and help you provide paradigm-shifting high planarization efficiency and low defect performance.
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Explore 3M CMP pad conditioner solutions, including diamond pad conditioners, metal-free brushes, advanced 3M™ Trizact™ Pad Conditioners and 3M™ Flexible Pad Conditioners, and innovative anti-metal leaching coatings.
Ready to redefine your CMP process?
Our sales reps and technical teams are here to help.
This information is based on tests performed at 3M laboratory facilities, and may be based on a limited sample size or a subset of 3M CMP materials. Many factors beyond 3M’s control and uniquely within the user’s control can affect the use and performance of 3M CMP materials in a particular semiconductor manufacturing application. To learn more about the specific properties and benefits of a given 3M CMP pad or 3M CMP pad conditioner, or to arrange a technical evaluation of the product, visit the 3M product catalog or contact 3M to speak with an expert.
