3M™ Trizact™ Pad Conditioner T Series

3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. Advanced 3M CVD diamond coating technology offers highly consistent, strong, tunable pad activation for demanding semiconductor CMP specifications and processes, including advanced nodes. Each CMP pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives.

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  Consistent Lifetime Performance
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  Metal-Free Surface
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  Slower Pad Wear Rate Decay
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  Yield Improvement

Slower pad wear rate decay

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  Conventional CMP pad conditioner

  As pad conditioners wear down, the coefficient of friction decreases rapidly, leading to pad wear rate decay.

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  3M™ Trizact™ Pad Conditioner T Series

  3M™ Trizact™ Pad Conditioner T Series maintains the tunable surface topography of 3M™ Trizact™ Pad Conditioners and combines it with increased diamond grain size to strengthen pad activation and reduce pad wear rate. This rougher diamond coating has a higher coefficient of friction that helps reduce pad wear rate by up to 4X.