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3M™ Diamond Pad Conditioner C Series

  • 3M ID B5005469001

Optimised diamond shape, pitch control and diamond orientation CMP pad conditioner

Improved consistency and reduced disk-to-disk variation

Slower pad wear rate decay with stable removal rate and profile

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Graphic highlighting CMP pad conditioner coating for metal-sensitive processes.
3M™ CMP Pad Conditioner Coatings

Enjoy effective conditioning for metal-sensitive processes. 3M™ CMP Pad Conditioner Coatings are a durable layer over the pad conditioner, which can help reduce metal leaching by up to 75%. The coating combines with powerful 3M sintered abrasive technology to further minimize micro and macro scratching defects.

Details

Highlights
  • Optimised diamond shape, pitch control and diamond orientation CMP pad conditioner
  • Improved consistency and reduced disk-to-disk variation
  • Slower pad wear rate decay with stable removal rate and profile
  • Enables potential for longer disk life and pad life
  • Uses 3M sintered abrasive technology for firm diamond adhesion
  • 40% improvement in flatness control over legacy designs

3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarisation (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimises wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk CMP pad conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond CMP pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimise your CMP performance.

  • improved CMP pads consistency
    Improved Consistency
  • Icon of a cross-section of CMP pad representing optimised topography
    Optimized Topography
  • Icon of a diamond cmp pad conditioner representing tunable performance
    Tunable Performance
3M CMP products mapped out by disk aggressiveness and pad roughness
Broad range of conditioning performance options

Extra-precise diamond placement

  • legacy 3m cmp pad conditioner
    Legacy 3M pad conditioner
  • 3M Diamond Pad Conditioner C Series
    3M™ Diamond Pad Conditioner C Series
Advanced Node (Memory & Logic), CMP and Wafer Manufacturing icons

Specifications

Resources

Frequently asked questions

3M uses a proprietary sintered abrasive process that attaches diamonds to the substrate with both chemical and mechanical bonds to enhance diamond retention.
Selecting a CMP pad conditioner requires compatibility testing to ensure that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries — tungsten to copper, poly to STI, and many more — that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Diamond Pad Conditioner C Series elevates our more than 25 years of experience with diamond pad conditioners to a new level of precision. Diamonds are placed in a precise grid at the micrometer scale, and oriented to maximize flatness, co-planarity and conditioning performance.

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Abrasive Material Diamond
Application Advanced Node (Memory & Logic), CMP, Wafer Manufacturing
Product Series C
Product Type Diamond Pad Conditioner
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