So much of 5G telecommunications infrastructure depends on the availability of low loss materials. 3M has decades of experience in compounding and chemistry for the manufacture of durable, lightweight plastics, composites and composites, ideal for the next generation in telecommunications.
Our solutions can help you optimize the performance of your 5G components. Our additives and functional fillers can partially replace costly resins, lower cycle times and increase part throughput. They can also help you meet tight standards for electrical and thermal performance.
Adding our 3M™ Boron Nitride Cooling Fillers (BNCF) can really make a difference for plastics or composites that must meet requirements for thermal performance and signal transmission in epoxy, polycarbonates (PC), silicone and other resins. Specifically in PC and fluoropolymers, our BN fillers show improved bonding compared to other thermal fillers. 3M™ BNCF can increase thermal conductivity and limit RF absorption properties in 5G components. Boron nitride-filled material features excellent dielectric properties including low Dk and Df to help maintain 5G signal strength and integrity.
As base stations and other 5G telecommunications assemblies are increasingly implemented, demand grows for lighter weight in every component. 3M solutions for low-loss plastics and composite materials include our latest 3M™ Glass Bubbles. These tiny, hollow microspheres feature extremely high crush strengths to withstand extrusion and injection molding processes. Blended with resins in 5G composite production, Glass Bubbles can help cut resin costs while reducing part weight from 15% to 40%. 3M™ Glass Bubbles for 5G can also: