Making the smaller chips that power next-generation technologies, including 5G devices, requires more demanding manufacturing processes than ever before. This means harsher chemicals and hotter temperatures, which all adds greater wear and tear on equipment – especially seals and gaskets.
When used in semiconductor seals and gaskets, 3M™ Dyneon™ Perfluoroelastomers and Fluoroelastomers help resist damage from harsh process conditions, extending the life of semiconductor production equipment and reducing costly and potentially dangerous seal failures.
Our materials are backed by decades of experience in fluoropolymer design and manufacturing. When you choose 3M, you not only get materials that help you build a better process – you get the benefit of expert application engineering support dedicated to helping meet the needs of the unique challenges and evolving landscape of the semiconductor sealing and gasket market.
From deposition to etching, these processes pose unique challenges to semiconductor manufacturing equipment, which can be addressed by using materials designed to stand up to them. 3M™ Dyneon™ High Temperature Perfluoroelastomers are engineered to deliver excellent reliability under the toughest process conditions, including wet side and plasma etching.
Need help with a tough materials challenge? Get in touch with us today for product, technical or application advice or if you want to collaborate with a 3M Technical Specialist.