3M™ Diamond Pad Conditioner H80-AL, 95 mm dia

• Optimized for extended pad and disk life
• Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
• Diamonds secured with both chemical and mechanical bonds for great retention
• Exclusive polymer substrate enhances corrosion resistance
• Customizable for conditioning aggressiveness
• Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.