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  6. 3M™ Diamond Pad Conditioner Ring E221, 260 mm diameter

3M™ Diamond Pad Conditioner Ring E221, 260 mm diameter

3M ID 60020008532
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life
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Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Specifications
Abrasive Material
Nickel-based Alloy with Patterned Diamond
Abrasive Working Surface
Segmented
Application
CMP
CMP Process
PMD/ILD
Manufacturing Location
United States
Product Series
E221