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  6. 3M™ Trizact™ Pad Conditioner B6-1900-5S2, 4.25 in dia

3M™ Trizact™ Pad Conditioner B6-1900-5S2, 4.25 in dia

3M ID 60020021667
  • Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
  • Accurately controlled microreplicated structures
  • Consistent performance disk-to-disk and the metal-free cutting surface
  • Ideal for advanced node processes sensitive to metallic contamination
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Details
  • Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
  • Accurately controlled microreplicated structures
  • Consistent performance disk-to-disk and the metal-free cutting surface
  • Ideal for advanced node processes sensitive to metallic contamination

Bringing together 3M’s know-how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner B6-1900 is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.

Specifications
Abrasive Material
CVD coated ceramic
Abrasive Working Surface
B6-1900 pattern
Application
CMP
Brand
Trizact™
Carrier Color
Grey
Carrier Format
Stainless steel carrier - with universal mouting configuration
Carrier Material
304 Stainless Steel
Carrier Size
4.25 inch diameter
Carrier Substrate
304 SS
CMP Process
AL
Product Series
B6-1900
Product Type
Diamond Pad Conditioner