Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.
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Abrasive Material
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Nickel based alloy with patterned diamond
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Abrasive Working Surface
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Segmented
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Application
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CMP
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Carrier Color
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Grey
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Carrier Format
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Ring
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Carrier Size
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14.17 inch diameter
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Carrier Substrate
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304 SS
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CMP Process
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Cu (bulk), PMD/ILD, W (bulk)
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Diamond Size
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251 um
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Diamond Type
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Type 8, sharp
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Manufacturing Location
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United States
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Product Series
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E3921
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