- Exclusive polymer substrate enhances corrosion resistance
- Durable brush bristles assist with removal of pad debris from porometric and felt-based pads
- Easy connection to polishing tool end effector
Details
- Exclusive polymer substrate enhances corrosion resistance
- Durable brush bristles assist with removal of pad debris from porometric and felt-based pads
- Easy connection to polishing tool end effector
Engineered CMP pad brushes are designed for critical semiconductor buff CMP applications.
Specifications
|
|
|
|---|---|
|
Abrasive Material
|
Nylon Fibers
|
|
Abrasive Working Surface
|
Full Face
|
|
Application
|
CMP
|
|
Brand
|
3M™
|
|
Bristle Diameter
|
0.005 in
|
|
Brush Material-Density
|
Nylon, >2000/sq in
|
|
Carrier Color
|
Black
|
|
Carrier Format
|
Disk
|
|
Carrier Material
|
Polycarbonate
|
|
Carrier Size
|
4.25 inch diameter
|
|
Carrier Substrate
|
Polycarbonate
|
|
CMP Process
|
Cu (barrier), Final Buff, W (buff)
|
|
Manufacturing Location
|
United States
|
|
Product Series
|
PB32A
|
|
Product Type
|
Pad Conditioner Brush
|
Resources
