- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for superior retention
- Exclusive polymer substrate enhances corrosion resistance
Details
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for superior retention
- Exclusive polymer substrate enhances corrosion resistance
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.
Specifications
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|
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|---|---|
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Abrasive Material
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Nickel based alloy with patterned diamond
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Abrasive Working Surface
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Ring Face
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Aggressiveness
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25-29
|
|
Application
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CMP
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|
Carrier Color
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Black
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Carrier Format
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Disk - with bevel edge
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Carrier Size
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4.25 inch diameter
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Carrier Substrate
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Polycarbonate
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CMP Process
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Cu (bulk)
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Diamond Size
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181 um
|
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Diamond Type
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Type 4, semi-sharp
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Manufacturing Location
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United States
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Product Series
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A2812
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Product Type
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Diamond Pad Conditioner
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Resources
