3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.
Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
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Abrasive Material
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Nickel-based Alloy with Patterned Diamond
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Abrasive Working Surface
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Ring Face
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Application
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CMP
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Carrier Material
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Polycarbonate
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CMP Process
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Cu (Bulk)
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Diamond Size
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181 micron
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Manufacturing Location
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United States
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Product Series
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A2812
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Product Type
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Diamond Pad Conditioner
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