Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
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Abrasive Material
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Nickel-based Alloy with Patterned Diamond
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Abrasive Working Surface
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Segmented
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Application
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CMP
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Brand
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3M™
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Carrier Material
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304 Stainless Steel
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CMP Process
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Cu (Bulk), PMD/ILD, W (Bulk)
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Diamond Size
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250 micron
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Manufacturing Location
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United States
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Product Series
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E3910
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Product Type
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Diamond Pad Conditioner
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