- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
Details
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
Specifications
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|
|
|---|---|
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Abrasive Material
|
Nickel based alloy with patterned diamond
|
|
Abrasive Working Surface
|
Full Face
|
|
Aggressiveness
|
9-16
|
|
Application
|
CMP
|
|
Brand
|
3M™
|
|
Carrier Color
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Grey
|
|
Carrier Format
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Disk
|
|
Carrier Material
|
410 Stainless Steel
|
|
Carrier Size
|
4.00 inch diameter
|
|
Carrier Substrate
|
410 SS
|
|
CMP Process
|
Cu (bulk), PMD/ILD, STI Process, W (bulk)
|
|
Diamond Size
|
151 um
|
|
Diamond Type
|
Type 3, semi blocky
|
|
Manufacturing Location
|
United States
|
|
Product Series
|
S122
|
|
Product Type
|
Diamond Pad Conditioner
|
Resources
