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3M™ MetPak™ 2-FB Inverse Header, MP2 Series

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Three levels of early mate, late break (EMLB) sequencing or selective loading options

Footprint compatible with standard Futurebus+®

Solder tail with true-position wafer

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Tech Data Sheet (PDF, 233KB)

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Highlights

Three levels of early mate, late break (EMLB) sequencing or selective loading options
Footprint compatible with standard Futurebus+®
Solder tail with true-position wafer
Ideal for hot swapping applications
End-to-end stackable
Right angle male for daughter card
Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

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