3M™ MetPak™ 2-FB Inverse Header, MP2 Series

Highlights

• Three levels of early mate, late break (EMLB) sequencing or selective loading options
• Footprint compatible with standard Futurebus+®
• Solder tail with true-position wafer
• Ideal for hot swapping applications
• End-to-end stackable
• Right angle male for daughter card
• Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
• See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
• For more information, refer to Data Sheet TS1122 (TS-1122)