3M™ Test & Burn-In Ball Grid Array Sockets, 93XX Series

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Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress

Contact tips touch ball above its center plane moving ball deformation away from seating plane

Designed to allow excellent air flow around device

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Details

Highlights
  • Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
  • Contact tips touch ball above its center plane moving ball deformation away from seating plane
  • Designed to allow excellent air flow around device
  • Includes a retractable locating guide for easy board mounting even with hundreds of leads
  • Compatible with most robotic handlers
  • Helps provide easy manual operation
  • Accepts package body sizes up to 47.5 mm square with a maximum matrix of 45 x 45
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information refer to Data Sheet TS9300 (TS-9300)

3M™ Test & Burn-In Ball Grid Array Sockets, 93XX series are available in types I, II, III. The double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress. Includes a retractable locating guide for easy board mounting even with hundreds of leads. Compatible with most robotic handlers while it provides easy manual operation.

Specifications