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3M™ Test & Burn-In SOIC Sockets

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Lid can be actuated from top or front and is compatible with automated load/unload equipment

Compact envelope and side to side stackability maximize board density

Tweezer slot for easy manual loading/unloading

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Lid can be actuated from top or front and is compatible with automated load/unload equipment
Compact envelope and side to side stackability maximize board density
Tweezer slot for easy manual loading/unloading
Lid applies 80 grams normal force per lead for maximum electrical reliability
Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths

Compact envelope w/ tweezer slot for easy loading

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