3M™ Test & Burn-In SOIC Sockets

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Lid can be actuated from top or front and is compatible with automated load/unload equipment

Compact envelope and side to side stackability maximize board density

Tweezer slot for easy manual loading/unloading

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Details

Highlights
  • Lid can be actuated from top or front and is compatible with automated load/unload equipment
  • Compact envelope and side to side stackability maximize board density
  • Tweezer slot for easy manual loading/unloading
  • Lid applies 80 grams normal force per lead for maximum electrical reliability
  • Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths

Compact envelope w/ tweezer slot for easy loading

Specifications