3M brings precision, efficiency and performance to your manufacturing process.
If you are involved in semiconductor production and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology and molding provide solutions which help enable the uniformity and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from CMP and surface finishing materials for wafer processing to fluids for thermal management to tape and reel for chip transport.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.