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3M Adhesives for Temporary Wafer Bonding. Stability and flexibility you can rely on.

  • explore our range of semiconductor tapes for die bonding, wire bonding and backside polishing

    Wafer thinning is now an essential process for a majority of fabricated and packaged devices. In response to the industrial challenge of handling such thin substrates, 3M semiconductor temporary adhesives feature a technology that effectively supports thinned substrates during the backside grinding process and other subsequent processes. Our technology answers all the requirements for ease of application, coating uniformity, good adhesion, thermal stability and ease of removal.

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