3M CMP and Surface Finishing Materials. For a true diamond grade experience for your CMP applications.

As the semiconductor market continues to move to smaller feature sizes, the need for superior CMP performance is increasing, with companies seeking higher yields at lower costs. This has led to 3M producing highly engineered pad conditioners to deliver the reliable performance that businesses seek for critical semiconductor CMP applications. Utilising Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion, our pad conditioners will improve the buffing cycle and provide lubrication to the paint surface to help prevent micro-marring during the initial break-in of a dry pad.